TEM Window Grids

Created by Kathleen Patrick, Modified on Tue, 21 May at 4:35 PM by Kathleen Patrick

Choosing the right TEM Window Grid, EMS76042 and EMS76043 Series:

 

Amorphous Silicon

Porous Nanocrystalline Silicon

Silicon Dioxide

Silicon Nitride

Standard Carbon

Ultrathin Carbon

Actual Thickness

5, 9, 15nm

15nm

20 & 40nm

5, 10, 20, 50nm

20-50nm

~10nm

Image Quality

Excellent

Good

Ok

Good

Ok

Good

Plasma Cleanable

Yes

Yes

Yes

Yes

No

No

Elemental Analysis Background

Si Only

Si Only

Si, O

Si, N

C, H

C, H

Thermal Stability

~600°C

>1000°C

>1000°C

>1000°C

~400°C

~400°C

Chemical Stability

Avoid Strong Bases

Avoid Strong Bases

Good

Excellent

Good

Good

Tolerates High Beam Currents

Excellent

Excellent

Ok

Ok

Excellent

Excellent

Potential Contamination Source

None

None

None

None

Carbon

Carbon

Open Nanoscale Pores

No

Yes

No

No

No

No

Background

Featureless

Nanocrystalline

Featureless

Featureless

Featureless

Featureless


Membrane Window Strength - Differential Pressure Tolerance:


Silicon Nitride


All the membrane types and membrane area configurations have been robustness tested by application of differential pressure. In these tests, the membrane was oriented such that differential pressure forced the membrane against the chip frame. In the opposite orientation where the membrane would be delaminated from the chip frame, the pressure tolerance would be several times lower.


All values below are the maximum tolerated differential pressure reported as mean +/- standard deviation (n = 3), in units of PSI.

Window Sizes:

  • 9 Windows: (8) 100 x 100, (1) 100 x 350 micron
  • 9 Small Windows: (8) 50 x 50, (1) 50 x 350 micron
  • 2 Slots: (2) 50 x 1500 micron
  • Single Windows: (1) square window of x micron side-length


Pure Silicon

Thickness

 

5nm

9nm

15nm

30nm

35nm

9 Windows

 

3.90 ± 0.71

11.57 ± 0.26

 

 

9 Small Windows

2.30 ± 0.29

 

 

 

 

2 Slots

2.60 ± 0.99

2.53 ± 0.40

14.73 ± 2.61

 

 

Single 25 Micron

35.33 ± 0.78

 

 

 

 

Nanoporous - 9 Windows

 

 

 

16.47 ± 0.95

 

Nanoporous - Single 500 Micron

 

 

 

3.33 ± 0.17

 

Single Crystal - 9 Windows

 

 

 

 

34.03 ± 1.07

 

Silicon Nitride

Thickness

 

5nm

10nm

20nm

50nm

9 Windows

 

6.13 ± 2.00

40+

40+

9 Small Windows

37.30 ± 3.08

 

 

 

9 Large Windows

 

11.57 ± 0.66

 

 

2 Slots

6.53 ± 0.24

 

 

 

Single 25 Micron

40+

 

 

 

Single 100 Micron

 

 

 

25.13 ± 4.45

Single 500 Micron

 

 

9.90 ± 0.36

13.37± 1.25

Single 1000 Micron

 

 

 

7.80 ± 0.29

Microporous - Single 500 Micron

 

 

5.37 ± 0.37

10.13 ± 0.52

Nanoporous - Single 500 Micron

 

 

5.33 ± 1.39

 

 

Silicon Dioxide

Thickness

 

20nm

40nm

75nm

9 Windows

11.33 ± 0.37

12.73 ± 0.68

 

G-Flat™ Single 1000 Micron

 

 

2.93 ± 0.17

 

X-Ray Windows

Thickness

 

50 nm

100 nm

200 nm

300 nm

Single 500 Micron

20.47 ± 0.33

24.40 ± 0.99

 

 

Single 1000 Micron

9.67 ± 0.12

13.13 ± 0.09

 

 

Single 1500 Micron

 

 

6.97 ± 0.25

 

Single 2500 Micron

 

 

4.07 ± 0.09

 

G-Flat™ Single 500 Micron

 

5.60 ± 0.29

 

11.53 ± 0.12

G-Flat™ Single 1000 Micron

 

 

2.63 ± 0.05

 

 

TEM Grid Handling Instructions:


TEM and X-Ray Windows are packaged in silicone gel-boxes with their suspended membrane films facing up (see cross-section). The suspended membrane side of TEM and X-Ray Windows should never be placed onto another surface in the opposite "face-down" orientation.

TEM and X-Ray Windows are packaged in silicone gel-boxes with their suspended membrane films facing up (see cross-section). The suspended membrane side of TEM and X-Ray Windows should never be placed onto another surface in the opposite "face-down" orientation.


We recommend handling TEM and X-Ray Windows from the sides of their frames using flat-sided, K6-style plastic or PTFE-coated tweezers. Do not directly touch the suspended membrane window. For best results when removing off the silicone gel-boxes, follow the technique shown in the figure (see below).


Cleaning

TEM and X-Ray Windows are made of ultrathin, silicon-based films that are very robust when dry, but care must be used when wet. For liquid cleaning, most organic solvents are compatible (e.g., isopropanol, acetone, toluene, etc...). Water or dilute solutions of HCl or H2SO4 can be used. Silicon nitride films can be cleaned in basic solutions, but dilute/weak bases can only be used for pure silicon and silicon dioxide films for short exposures (<10 seconds).

When introducing TEM and X-Ray Windows into a solution, the chip should be held vertically with tweezers. The chip can then be moved up and down in the cleaning solution. To rinse, transfer to distilled/deionised water using the same method.


Plasma Cleaning

For plasma cleaning, we recommend using pure O2 if possible as Ar will degrade nanometer-thick films over time. Typical O2/Ar mixtures are acceptable. In general, silicon-based films can be cleaned for significantly longer (>60 seconds) than conventional carbon films, eliminating most organic contaminants. UV-ozone treatment is compatible as well. We recommend comparing a treated and untreated TEM or X-Ray Window when first characterizing cleaning protocols. If light microscope inspection reveals substantial change in color or wrinkling of the treated suspended membrane film, then conditions may be too aggressive and may have degraded the membrane film. We recommend following the system manufacturer's power settings. Note that pure silicon TEM Windows will oxidise in the presence of O2 at elevated temperatures and crystallise at >600°C.


Sample Deposition

When applying a liquid sample, we recommend placing a small drop of solution and wicking away the excess with a clean laboratory or lens tissue. The specimen should be allowed to dry in a clean environment as rapidly as possible to minimize contamination. If adhesion or dispersion is not as desired, pretreatment by O2 plasma or UV-ozone can be used to increase surface hydrophilicity. The use of typical MEMS processes for depositing other thin films is compatible with most TEM and X-Ray Windows. We recommend avoiding highly stressed films and/or high stress mis-matches that may occur during high-temperature depositions. Spin-coating other films is compatible as well, but we recommend an appropriate holder that avoids direct exposure of the suspended membrane to vacuum during spin-coating.


Other Specifications

Temperature and differential pressure tolerances are available by visiting our Technical Info page on the left navigation bar. Please contact us with any questions or concerns.


Citations:


Silicon Nitride


Non-Porous Pure Silicon


Porous Pure Silicon


Silicon Dioxide

 


 

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