CDMS‐ 1T, 2mm ‐ 1µm, Traceable
Product Description: 2.5x2.5mm Critical Dimension Magnification Standard
Wafer Identifier: CD‐PG01
The accuracy of these products was determined by reference comparison to working standards traceable to the National Institute of Standards and Technology (NIST), Test No. 861/280822‐11.
| Line | Average pitch of wafer | Number of lines averaged | Average pitch uniformity (1σ uncertainty) | Total expanded uncertainty (3σ) average pitch for wafer* |
| 2.0mm | 2.01mm | 2 | ± 4µm (±0.20%) | ± 7µm (±0.35%) |
| 1.0mm | 1.00mm | 2 | ± 2µm (±0.20%) | ± 3.5µm (±0.35%) |
| 0.5mm | 0.500mm | 2 | ± 1µm (±0.20%) | ± 1.75µm (±0.35%) |
| 0.25mm | 0.250mm | 2 | ± 0.5µm (±0.20%) | ± 0.9µm (±0.35%) |
| 10µm | 10.01µm | 9 | ± 0.02µm (±0.20%) | ± 0.035µm (±0.35%) |
| 5µm | 5.00µm | 10 | ± 0.01µm (±0.20%) | ± 0.0175µm (±0.35%) |
| 2µm | 2.00µm | 10 | ± 0.007µm (±0.35%) | ± 0.014µm (±0.7%) |
| 1µm | 1.00µm | 10 | ± 0.0035µm (±0.35%) | ± 0.007µm (±0.7%) |
* The 3σ uncertainty (95% confidence interval) average pitch is determined using a minimum of nine die per production wafer. Each average pitch is determined using 100 measurements on each die averaged over the stated number of lines. The total expanded uncertainty includes both Type A and Type B uncertainties corrected for sample size using an appropriate Student t‐factor.
Equipment used:
| Instrument | Model number | Serial number | Resolution | Repeatability |
| FE‐SEM | FEI Quanta 3D FEG | D8894 | 1.2nm | 0.03% |
This certificate shall not be reproduced without permission.
682‐1 TN VPG‐01 09162011
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